Titanium-infused Nichrome Thin Films for Applications in Extreme Thermal Environments

Authors

  • Aarna Gupta Department of Electrical and Computer Engineering, George Mason University, Fairfax, VA
  • Pranav Choori Department of Electrical and Computer Engineering, George Mason University, Fairfax, VA
  • Julia Rodrigues Physics, College of William & Mary, Williamsburg, VA
  • Fitunerediate Gebeyehu Department of Electrical and Computer Engineering, George Mason University, Fairfax, VA
  • Sezin Sayin Department of Electrical and Computer Engineering, George Mason University, Fairfax, VA
  • Shawn Wagoner Department of Electrical and Computer Engineering, George Mason University, Fairfax, VA
  • Ethan C. Ahn Department of Electrical and Computer Engineering, George Mason University, Fairfax, VA

Abstract

Nichrome (NiCr) alloys are widely used in nanoelectronics and aerospace due to their relatively high electrical resistivity and ability to withstand high temperatures. Physical properties of NiCr, including high temperature stability, have been widely studied with sputtered NiCr thin films. However, literature lacks information regarding how adding foreign elements to NiCr (metallic impurities) improves or affects NiCr properties. This project explores the impact of Titanium (Ti), a conductive and corrosion-resistant metal, on physical properties of NiCr. Ti-infused NiCr alloys were synthesized using a co-sputtering technique while keeping the NiCr power at 250 W and varying the Ti power from 25 W to 150 W. Material characterization was performed by measuring the electrical resistivity, thickness, and composition by using a four-point probe, a stylus profilometer, and an energy-dispersive X-ray spectroscopy (EDS) technique, respectively. The study demonstrates that adding Ti to NiCr increases both the thickness and electrical resistivity, indicating a positive linear relationship while potentially improving the resistance of the film to heat corrosion. These unique properties of Ti-infused NiCr alloys may prove useful in both electrical and thermal engineering for extreme environments.

Published

2025-09-25

Issue

Section

College of Engineering and Computing: Department of Electrical and Computer Engineering